A timeline of semiconductor process nodes
A process node names a generation of chip manufacturing technology. Smaller node numbers historically meant smaller transistors, but since around 22nm the names are marketing labels for a process generation rather than a measured dimension. This reference lays out the path from 90nm down to 2nm, with the approximate year each entered volume production, the dominant makers, and the transistor structure that defined it.
How it works
Each new node packs more transistors into the same area and usually improves speed and power. The big structural shifts matter more than the numbers: planar transistors gave way to FinFET around 22nm/16nm, and gate-all-around (GAA) nanosheet transistors arrived at the 3nm/2nm generations. Because foundries label generations differently, the same-named node from two makers is not identical — Intel’s renamed roadmap (Intel 7, 4, 3, 20A, 18A) realigns its names with TSMC and Samsung. Years shown are approximate first volume-production dates, which can differ from first-announcement or first-tape-out dates.
Tips and notes
- Node names below ~22nm are marketing generations, not physical gate lengths.
- The planar → FinFET → GAA progression is the real engineering story.
- Intel 18A’s “A” means ångström — roughly a 1.8nm-class node.
- Treat the years as volume-production estimates; sources vary by a year.